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Lamination Pads

In the past, many layers of paper were used as a cushion for the lamination process. Modern Press Pads consist of multiple heat-resistant layers with different features. As in consequence, we develop different lamination pads for different purposes.

HTP 8200

The HTP supplements the Schwan portfolio with a high-temperature-resistant press pad. This extends the range of laminations applications up to 300°C. Compared to our usual pads, these pads consist of two outer layers made of woven fiber. The additional layers result in a much stiffer pad, improving the handling during the loading process. Moreover the HTP is antistatic to lower static charging during the lamination process.
 
  • Rebounding Level: Very high, up to 99%, even after hundreds of press cycles.
  • Available Thickness in mm: 3.

Included Services

Optional Services

Technical Details:
 
  • Material: Outer layers Mineral-Fibre, 2 inner layers with silicone rubber, 1 middle layer of glass fibre.
  • Surface: Woven fibre
  • Max. Temperature: 300 °C.
  • Rebounding level up to 99%.
  • Compression: Thickness remains over the complete lifecycle.
  • Application: PCB, PVC, PC, ABS, PET(G), etc.
  • Available Thickness: 3.0 mm.