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Lamination Pads

In the past, many layers of paper were used as a cushion for the lamination process. Modern Press Pads consist of multiple heat-resistant layers with different features. As in consequence, we develop different lamination pads for different purposes.

Phoenix

Some lamination processes like PCB require significant higher temperature.

Like the Phoenix from the ashes, this press pad will resist and remain in temperatures up to 400 degrees Celsius. As in consequence, this press pad is a good option for lamination processes above 250 °C.

The main components are glass fibre and aluminium. The outer layers are respectively thick, we recommend protection gloves to avoid hazard!

Every pad is produced on demand, according to the specific requirements of the lamination process. Size and special treatments are hand customized here in Viersen Germany.
 
  • Rebounding: Very high, up to 93%.
  • Available Thickness: 2.5 mm.

Included Services

Optional Services

Technical Details

  • Material: Outer layers special aluminium foil, inner layer high temperature resistant glass fibre.
  • Surface: Top and bottom plain aluminium foil.
  • Max. Temperature: 400 °C.
  • Rebounding level up to 93%.
  • Application: PCB, PVC, PC, ABS, PET(G), etc.